A523
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A523 | |
---|---|
Manufacturer | Allwinner |
Process | 22 nm |
CPU | Octa-Core ARM [email protected] big.LITTLE + E906 RISC-V@200MHz |
Memory | DDR3 LPDDR3 DDR4 LPDDR4 LPDDR4X 32bit@2400M |
GPU | Mali G57 MC1 2EE |
Connectivity | |
Video | 1x RGB, 2x MIPI-DSI, 1x Dual-LVDS, 1x eDP1.3, Up to 2560x1600@60Hz |
Network | 1 x Ethernet GMAC 100M/1000M |
Storage | MMC, eMMC 5.1, SPI Flash |
USB | 1 x USB3.0, 2 x USB2.0 |
Other | 1 x PCIE 2.1 1lane |
Release Date | 2023 |
Overview
The Allwinner A523 (sun55iw3) SoC features two quad-core Arm Cortex-A55 CPU clusters (for a total of eight cores), a Arm Mali-G57 MC1-2EE GPU, and a XuanTie E906 RISC-V management core. It is mainly targeted at tablet computers, though PCIe, USB 3.0, eDP and a Gigabit Ethernet MAC open up more use cases.
The USB 3.0 controller and the single lane PCIe 2.1 controller share the output pins, via a combo-PHY, so cannot be used at the same time.
A523 SoC Features
- CPU
- ARM Cortex-A55 r2p0 Octa-Core
- 32 KiB Instruction + 32KiB Data L1-Cache per core
- 64 KiB Unified L2-Cache per core (for core 0-3, TBC: 128 KiB each for cores 4-7)
- 1 MiB Unified L3-Cache (shared between all eight cores)
- SIMD NEON, VFP4, crypto extensions (AES), Half precision floating point (FP16), ARMv8.4 dot product extensions
- ARMv8.1 atomics, LDAPR (load acquire)
- Virtualization, ARMv8.1 Virtualization Host Extensions (VHE)
- Arm GIC-600 r1p4 GICv3 interrupt controller, no LPIs, one (dormant) ITS
- Memory
- DDR3/DDR4/LPDDR2/LPDDR3/LPDDR4/LPDDR4X 32-bit DRAM controller, up to 4GiB
- Embedded Controller:
- XuanTie E906 RISC-V microcontroller (no MMU, but PMU)
- 22nm HPC process
Family of sun55iw3
Beside the actual Allwinner A523 chip, there are several siblings sharing the same "sun55iw3" die, in different packages and different performance bins:
Main Name | A523 | A523 | A527 | A527 | MR527 | T527 | T527 | T527 | T527 |
---|---|---|---|---|---|---|---|---|---|
Sub Name | M00X0000 | H00X0000 | M00X0000 | H00X0000 | M02X0D00 | M00X0DCH | M02X0DCH | H00X0DCH | H02X0DCH |
Package | FCCSP15*15 BGA522 | EPCSP17*17 BGA664 | HS-FCBGA17*17 BGA664 | ||||||
CPU | [email protected] + [email protected] | 4xA55@2.0GHz + [email protected] | [email protected] + [email protected] | 4xA55@2.0GHz + [email protected] | [email protected] + [email protected] | [email protected] + [email protected] | [email protected] + [email protected] | 4xA55@2.0GHz + [email protected] | 4xA55@2.0GHz + [email protected] |
RISC-V | XuanTie E906 RISC-V@200M | ||||||||
GPU | Mali G57 MC1 2EE | ||||||||
NPU | - | - | - | - | VIP9000 2Tops | - | VIP9000 2Tops | - | VIP9000 2Tops |
DSP | - | - | - | - | - | HIFI4 DSP 600M | |||
H264 Decode | 4K@30fps | 4K@60fps | 4K@30fps | 4K@60fps | |||||
H265 Decode | 4K@30fps | ||||||||
H264 Encode | 4K@25fps | ||||||||
MIPI CSI/BK | 4 | 6 | |||||||
Maximum resolution | 2.5K | 4K+1080P | - | 4K+1080P | |||||
Video Out | 1xRGB, 2xMIPI, 1xDual-LVDS, 1xeDP | - | 1xRGB, 2xMIPI, 1xDual-LVDS, 1xeDP | ||||||
HDMI | - | - | HDMI2.0 | - | HDMI2.0 | ||||
GMAC | 1 | 2 | - | 2 | |||||
CAN | - | - | - | - | - | 2 | |||
USB | 2xUSB2.0 + 1xUSB3.0 | ||||||||
Temperature | -20℃~75℃ | -40℃~85℃ | |||||||
Target | Tablets | Tablets | Tablets | Tablets | Robots | Industry | Industry | Industry | Industry |
Documentation
There is a user manual at the DeciHD github repo.
BSP code parts can be found using Github's code search for the die name: sun55iw3
References
- CNX Software article (some features seem to have vanished from the preliminary spec: HDMI, second GMAC, Hifi4 DSP)
- DeciHD GitHub repository
- (register dump via FEL)